研討會論文 - 國際研討會

  1. R.-T. Wang and J.-C. Wang*, 2023, Hybrid Nanofluids of Intelligent Dimensional Analysis with Experimentation, the 3rd Global Experts Conference on Applied Science, Engineering and Technology (GECASET-2023), July 24-26, 2023 in Osaka, Japan.

  2. E. Aganus, C.-A. Yang, N. Quintero and J.-C. Wang*, 2022, Water Quality Assessment of Keelung Port, Paper ID: 127, 12th International Conference on Environmental Pollution and Remediation (ICEPR’22), July 31-August 02, 2022, Prague, Czech.

  3. J.-C. Wang* , 2019, Thermoelectric Energy Generation System of Nanofluids, Paper ID: SK2-013. The 5th International Conference on Renewable Energy Technologies (ICRET 2019), January 26-28, 2019, Seoul, South Korea.

  4. J.-C. Wang* , 2018, Thermal Energy Storage of Alumina Nanofluids using Innovation Dimensional Analysis, Keynote Forum, 11th World Bioenergy Congress and Expo, July 02-04, 2018, Berlin, Germany.

  5. J.-C. Wang* , 2017, Power Generation Saving System of Alumina Nanofluids using Innovation Dimensional Analysis, Paper ID: MIPE-0011, International Conference on Mechanical, Industrial and Power Engineering (2017 MIPE), August 14-16, 2017, Osaka, Japan.

  6. J.-C. Wang* , 2017, Thermal Management of High-Brightness Materials, Paper ID: SICEAS-635, Seoul International Conference on Engineering and Applied Science (SICEAS 2017), February 7-9, 2017, Seoul, South Korea.

  7. R.-T. Wang and J.-C. Wang* , 2015, 3-D Experimental Model Analysis of Heat Pipes Thermal Modules, Paper ID: ACENS-43, The Asian Conference on Engineering and Natural Sciences (ACENS 2015), February 3-5, 2015, Tokyo, Japan.

  8. R.-T. Wang, J.-C. Wang* , Guan-Cing Liu, 2014, Thermal System Analysis for HighPower LED Illumination Lamp Paper ID: 2152, International Conference on Engineering and Applied Science (ICEAS 2014), 22-24July, 2014, Hokkaido, Japan.

  9. J.-C. Wang* , 2014, Thermal Characterization Analysis of Heat-Sink Heat Pipes Under Forced Convection, Paper ID: 1004867, 10th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT2014), 14-16 July 2014, Orlando, USA.

  10. J.-C. Wang* and L.-W. Ye, 2014, Investigation on Thermo-Fluid Characteristics of Al2O3 Nanofluid using Power Generation Facility, Paper ID: 1185, ICAE2014: the 6th International Conference on Applied Energy, May 30-June 2, 2014, Taipei, Taiwan.

  11. W.-K. Lin, R.-T. Wang, J.-C. Wang, 2013, The Performance Measurement of Marine Logistics Information Platform, 2013 International Conference on Information and Communication Technology for Education (ICTE2013), December 1-2, 2013, Singapore.

  12. J.-C. Wang* and W.-C. Chiang, 2013, Researches on Thermo-Electric Properties of Seawater and Al2O3 Nanofluids, 2013 International Conference on Mechatronics, Applied Mechanics and Energy Engineering (MAMEE 2013), July 27-29, Singapore, pp. 1.

  13. J.-C. Wang* , W.-C. Chiang, C.-L. Huang and H.-L. Wu, 2012, GREENLIGHTING RECYCLABLE DEVICE OF LED-MGVC, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2012. IMPACT 2012. 7th International, pp. 98-101.(IEEE CNF; ISBN: 978-1-4673-1638-5) (EI).

  14. J.-C. Wang* , W.-J. Chen and F.-H. Yu, 2012, HSHPTM Program Application in Optimum of Heat Pipes Thermal Module, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2012. IMPACT 2012. 7th International, pp. 291- 294.(IEEE CNF; ISBN: 978-1-4673-1638-5) (EI).

  15. J.-C. Wang* and R.-T. Wang, 2012, LED-MGVC Using Computer Aided Modeling Design, the 2nd International Conference on Computer Science and Logistics Engineering (ICCSLE2012), Oct. 19~21, 2012 in Zhengzhou, China.

  16. R.-T. Wang, J.-C. Wang and L.-M. Chen, 2012, ECONOMIC CHALLENGES FOR TAIWAN PRIVATE SENIOR HIGHSCHOOLS: PERFORMANCE EVALUATION BASED ONA REVISED INDICATORS FRAMEWORK, 2012 3rd International Asia Conference on industrial engineering and management innovation (IEMI2012), August 10-11, 2012, in Beijing, China (EI).

  17. J.-C. Wang* , 2012, Novel Marine Battery to Drive LED Display, 2012 Third International Multicomponent Polymer Conference Polymer (IMPC 2012), 23-25 March 2012, Kottayam, Kerala, India.

  18. J.-C. Wang* , 2012, LED with Ocean Battery, 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), Jan. 18~19, 2012 in HongKong.

  19. J.-C. Wang* and W.-J. Chen, 2011, Thermal Analysis for L-type Heat Pipes Heat Sink with Dual Fans, 11th International Conference on Fluid Control, Measurements, and Visualization (FLUCOME 2011), December 5th to 9th, 2011, in Keelung, Taiwan. (Paper No.: 117).

  20. J.-C. Wang* , T.-S. Sung and W.-P. Chen, 2011, Hyper-Generation LEDs VCPCB, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2011. IMPACT 2011. 6th International, pp.332-335.(IEEE CNF; ISBN: 978-1-4577-1388-0) (EI).

  21. J.-C. Wang* and W.-J. Chen, 2011, Vapor Chamber in High-end VGA Card, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2011. IMPACT 2011. 6th International, pp.393-396.(IEEE CNF; ISBN: 978-1-4577-1388-0) (EI).

  22. R.-T. Wang and J.-C. Wang, 2011, Green Illumination Techniques applying LEDs Lighting, Proceedings of GETM 2011 May 28, pp.1-7, Changhua, Taiwan.

  23. J.-C. Wang* and Y.-P. Tsai, 2011, Analysis for Diving Regulator of Manufacturing Process, 2011 International Conference on Advanced Material Research (ICAMR 2011), 21-23 January 2011, in Chongqing, China.

  24. J.-C. Wang* and C.-L. Huang, 2010, VAPOR CHAMBER IN HIGH POWER LEDS, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2010. IMPACT 2010. 5th International, pp.1-4.(IEEE CNF; ISBN: 978-1-4244-9783- 6) (EI).
  25. T.-L. Chang, H.-P. Yang, Y.-H. Kuo, J.-C. Wang, C.-P. Wang, 2010, Circular Optical Microstructures Fabricated Using Ultra-Pulsed Laser Ablation and UV Imprint Process, 36th International Micro- and Nano- EngineeringConference (MNE2010), Genoa, Italy P-NANO-68.

  26. J.-C. Wang* , T.-L. Chang and Y.-K. Chang, 2010, Window Program of Heat Sink Heat Pipes Thermal Module, 7th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, HEFAT2010, 19-21 July 2010, Antalya, Turkey.

  27. J.-C. Wang* , and Y.-P. Tsai, 2010, Investigations on Scuba Diving Regulators, 29th International Conference on Ocean, Offshore and Arctic Engineering: Vol. 2, OMAE2010, June 6-11, 2010, Shanghai, China. Paper no. OMAE2010-21089 pp. 767-772.

  28. J.-C. Wang* and T.-C. Chen, 2009, Vapor Chamber in High Performance Server, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.364-367.(IEEE CNF; ISBN: 978-1-4244-4341-3) (EI) (NTOU 校長設備費 and NSC 97-2218-E-019-003).

  29. J.-C. Wang* , 2009, Developing Window Program of Heat Sink with Embedded Heat Pipes, Proceedings of the Fourth International Conference on Thermal Engineering: Theory and Applications, January 12-14, 2009, Abu Dhabi, UAE,P.1-P.7.

  30. Y.-P. Tsai and J.-C. Wang, 2008, The Effects of Rotor Incorporated Mold for the Elimination of the Welding Line in Injection Molding, ANTEC. (EI). 

  31. T.-L. Chang and J.-C. Wang, 2007, Study of Nanopattern Forming with Chemical Coatings for Silicon–Based Stamp in Nanoimprint Process, Processing of IEEE-NANO, pp. 795-798. (IEEE CNF; ISBN: 978-1-4244-0607-4) (EI).

  32. T.-L. Chang and J.-C. Wang, 2007, Study of Nanopattern Forming with Chemical Coatings for Silicon–Based Stamp in Nanoimprint Process, Proceedings of the 7th IEEE, International Conference on Nanotechnology, August 2 - 5, 2007, Hong Kong.

  33. T.-L. Chang, J.-C. Wang, W.-L. Lai, C.-C. Chen, H.-Y. Lin, F.-H. Ko, F.-Y. Chang, S.-H. Chang, 2007, A Novel Non-Fluorine Mold Release Agent for Ni Stamp in Nanoimprint Process, 33rd International Conference on Micro- and Nano-Engineering, 23-26 September 2007, Copenhagen, Denmark.

  34. T.-L. Chang, J.-C. Wang, Y.-J. Tsai, Y.-R. Huang and C.-C. Chen, 2007, Study of Ni Nanopattern Stamps with Non-Fluorine Coating Treatment in Nanoimprint Process, 14th Symposium on Nano Device Technology (SNDT2007), Hsinchu, Taiwan, No.T5- 32.

  35. H.-S. Huang, J.-C. Wang and S.-L. Chen, 2007, Experimental Investigation on Thermal Performance of Heat Sink with Two Pairs of Embedded Heat Pipes, Proceedings of IPACK2007, ASME InterPACK`07.

  36. J.-C. Wang and S.-L. Chen, 2007, Thermal Performance of Two-Phase Closed Thermosyphon Cooling System, Proceedings of the Third International Conference on Thermal Engineering: Theory and Applications May 21-23, Amman, Jordan.