一、 期刊論文

A. 國際學術期刊

1. J.-C. Wang, C.-Y. Lin, T.-C. Chen 2012, Thermal performance of a vapor chamber-based plate of high-power LEDs filled with Al2O3 nanofluid,JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, Vol., No. , November, pp.. In press. (SCI) (IF=1.563)
2.J.-C. Wang*, 2012, 3-D Numerical and Experimental Models for Flat and Embedded Heat Pipes Applied in High-end VGA Card Cooling System, International Communications in Heat and Mass Transfer, Vol. 39, Issue 9, November, pp.1360-1366. (SCI) (IF=1.892)
3.J.-C. Wang*, 2012, Novel green illumination energy for LED with ocean battery materials, INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, Vol. 44, Nos. 3/4, pp.187-200. (SCI) (IF=0.315)
4.R.-T. Wang and J.-C. Wang*, 2012, Analyzing the Pressure-Difference Phenomenon between the Condensing and Boiling Sections in a Heat Pipe Cooling System, International Communications in Heat and Mass Transfer, Vol. 39, Issue 3, March, pp.390-398. (SCI) (IF=1.892).
5. J.-C. Wang*, 2012, LED with Ocean Battery, Advanced Materials Research, Vols. 378-379, pp. 646-649. (EI).
6.J.-C. Wang*, 2011, Thermal Investigations on LEDs Vapor Chamber-Based Plates,International Communications in Heat and Mass Transfer, Vol.38, Issue 9, November,pp. 1206-1212. (SCI) (IF=1.892)
7. C.-Y. Lin, J.-C. Wang and T.-C. Chen, 2011, Analysis of suspension and heat transfer characteristics of Al2O3 nanofluids prepared through ultrasonic vibration, Applied Energy, Vol. 88, Issue 12, pp. 4527-4533. (NSC 98-2221-E019-039) (SCI) (IF=5.106)
8.J.-C. Wang*, and R.-T. Wang, 2011, A Novel Formula for Effective Thermal
Conductivity of Vapor Chamber, EXPERIMENTAL TECHNIQUES, Vol. 35, Issue 5,
September/October, pp.35-40. (SCI) (IF=0.257)
9. R.-T. Wang, J.-C. Wang*, and T.-L. Chang, 2011, Experimental Analysis for Thermal Performance of a Vapor Chamber Applied to High-Performance Servers, Journal of Marine Science and Technology-Taiwan, Vol. 19, No. 4, July/August, pp.353-360. (SCI) (IF=0.483). (NTOU 校長設備費and NSC 97-2218-E-019-003)
10. J.-C. Wang*, 2011, Applied Vapor Chambers on Non-uniform Thermo Physical Conditions, Applied Physics, Vol. 1, pp.20-26.
11. J.-C. Wang*, 2011, Investigations on Non-Condensation Gas of a Heat Pipe,Engineering, Vol. 3, pp.376-383.

12. J.-C. Wang*, A.-T. Li, Y.-P. Tsai, and R.-Q. Hsu, 2011, Analysis for Diving Regulator Applying Local Heating Mechanism of Vapor Chamber in Insert Molding Process, International Communications in Heat and Mass Transfer, Vol. 38, Issue 2, February, pp.179-183. (SCI) (IF=1.892).(Invited Speaker for 2011 Turkey International Modern Medical Forum (2011 TIMF), http://www.epsworldlink.com/index.php?option=com_content&view=article&id=757&Itemid=923&lang=en)
13. J.-C. Wang* and Y.-P. Tsai, 2011, Analysis for Diving Regulator of Manufacturing Process, Advanced Materials Research, Vol. 213, pp. 68-72. (EI).
14. Y.-P. Tsai, J.-C. Wang*, R.-Q. Hsu, 2011, The Effect of Vapor Chamber in an Injection Molding Process on Part Tensile Strength, EXPERIMENTAL TECHNIQUES, Vol. 35, Issue 1, January/February, pp.60-64. (SCI) (IF=0.257)

15. J.-C. Wang*, 2011, L-type Heat Pipes Application in Electronic Cooling System, International Journal of Thermal Sciences, Vol.50 , Issue 1, January, pp.97-105. (NSC 98-2221-E019-039) (SCI) (IF=2.142)
16. J.-C. Wang*, R.-T. Wang, T.-L. Chang, D.-S. Hwang, 2010, Development of 30 Watt High-Power LEDs Vapor Chamber-Based Plate, International Journal of Heat and Mass Transfer, Vol. 53 , Issue 19/20 , September, pp.3900-4001. (SCI) (IF=2.407) (NTOU 校長設備費and NSC 97-2218-E-019-003)
17. C.-C. Chang, Y.-F. Kuo, J.-C. Wang, and S.-L. Chen, 2010, Air Cooling for a Large Scale Motor, Applied Thermal Engineering, Vol.30, Issue 11-12, August, pp.1360-1368.(SCI) (IF=2.064)

18. J.-C. Wang*, 2010, Development of Vapour Chamber-based VGA Thermal Module, International Journal of Numerical Methods for Heat & Fluid Flow, Vol.20, Issue 4, May, pp.416-428. (SCI) (IF=0.527)
19. J.-C. Wang*, R.-T. Wang, C.-C. Chang and C.-L. Huang, 2010, Program for Rapid Computation of the Thermal Performance of a Heat Sink with Embedded Heat Pipes. Journal of the Chinese Society of Mechanical Engineers, Vol. 31, Issue 1, February, pp.21-28. (NSC 98-2221-E019-039) (SCI) (IF=0.548)
20. J.-C. Wang*, 2009, Superposition Method to Investigate the Thermal Performance of Heat Sink with Embedded Heat Pipes, International Communications in Heat and Mass Transfer, Vol.36, Issue 7, August, pp. 686-692. (SCI) (IF=1.892)
21. Y.-P. Tsai, J.-C. Wang*, 2009, Vapor Chamber in Injection Molding Process, International Review of Chemical Engineering (Rapid Communications), Vol.1, N.2, P.179-P.182.
22. J.-C. Wang*, 2008, Novel Thermal Resistance Network Analysis of Heat Sink with Embedded Heat Pipes, Jordan Journal of Mechanical and Industrial Engineering, Vol. 2, No. 1, Mar., pp. 23-30.
23. T.-L. Chang, J.-C. Wang, C.-C. Chen, Y.-W. Lee and T.-H. Chou, 2008, A Non- Fluorine Mold Release Agent for Ni Stamp in Nanoimprint Process, Microelectronic Engineering, Vol.85, Issue 7, July, pp. 1608-1612. (SCI) (IF=1.569)
24. Y.-W. Chang, C.-H. Cheng, J.-C. Wang and S.-L. Chen, 2008, Heat Pipe for Cooling of Electronic Equipment, Energy Conversion and Management, Vol.49, Nov., pp.3398-3404. (SCI) (IF=2.054)
25. J.-C. Wang, H.-S. Huang and S.-L. Chen, 2007, Experimental Investigations of Thermal Resistance of a Heat Sink with Horizontal Embedded Heat Pipes, International Communications in Heat and Mass Transfer, Vol.34, Issue 8, October, pp. 958-970. (SCI) (IF= 1.892)
26. J.-C. Wang, S.-J. Lin, S.-L. Chen and W.-S. Lee, 2005, Charge and Discharge Characteristics of a Thermal Energy Storage Device, Experimental Heat Transfer, Vol. 18, No. 1, Jan.-Mar., pp. 45-60. (SCI) (IF = 0.425)