二、 研討會論文

A. 國際學術研討會

1.J.-C. Wang*, W.-C. Chiang and C.-L. Huang, 2012, GREEN-LIGHTING RECYCLABLE DEVICE OF LED-MGVC, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2012. IMPACT 2012. 7th International, pp. - .(IEEE CNF; ISBN: 978-1-4577-1388-0) (EI).
2.J.-C. Wang* and W.-J. Chen, 2012, HSHPTM Program Application in Optimum of Heat Pipes Thermal Module, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2012. IMPACT 2012. 7th International, pp. - .(IEEE CNF; ISBN: 978-1-4577-1388-0) (EI).
3.J.-C. Wang* and R.-T. Wang, 2012, LED-MGVC Using Computer Aided Modeling Design, the 2nd International Conference on Computer Science and Logistics Engineering (ICCSLE2012), Oct. 19~21, 2012 in Zhengzhou, China.
4. R.-T. Wang, J.-C. Wang and L.-M. Chen, 2012, ECONOMIC CHALLENGES FOR TAIWAN PRIVATE SENIOR HIGHSCHOOLS: PERFORMANCE EVALUATION BASED ONA REVISED INDICATORS FRAMEWORK, 2012 3rd International Asia Conference on industrial engineering and management innovation (IEMI2012), August 10-11, 2012, in Beijing, China.
5.J.-C. Wang*, 2012, Novel Marine Battery to Drive LED Display, 2012 Third International Multicomponent Polymer Conference Polymer (IMPC 2012), 23-25 March 2012, Kottayam, Kerala, India. (Invited Speaker http://www.icbc2012.in/invitedspeakers.html )
6.J.-C. Wang*, 2012, LED with Ocean Battery, 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), Jan. 18~19, 2012 in HongKong.
7. J.-C. Wang* and W.-J. Chen, 2011, Thermal Analysis for L-type Heat Pipes Heat Sink with Dual Fans, 11th International Conference on Fluid Control, Measurements, and Visualization (FLUCOME 2011), December 5th to 9th, 2011, in Keelung, Taiwan.
8.J.-C. Wang*, T.-S. Sung and W.-P. Chen, 2011, Hyper-Generation LEDs VCPCB, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2011. IMPACT 2011. 6th International, pp.332-335.(IEEE CNF; ISBN: 978-1-4577-1388-0)(EI).
9.J.-C. Wang* and W.-J. Chen, 2011, Vapor Chamber in High-end VGA Card, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2011. IMPACT 2011. 6th International, pp.393-396.(IEEE CNF; ISBN: 978-1-4577-1388-0)(EI).
10. R.-T. Wang and J.-C. Wang, 2011, Green Illumination Techniques applying LEDs Lighting, Proceedings of GETM 2011 May 28, pp.1-7, Changhua, Taiwan.
11. J.-C. Wang* and Y.-P. Tsai, 2011, Analysis for Diving Regulator of Manufacturing Process, 2011 International Conference on Advanced Material Research (ICAMR 2011), 21-23 January 2011, in Chongqing, China.
12. J.-C. Wang* and C.-L. Huang, 2010, VAPOR CHAMBER IN HIGH POWER LEDS, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2010. IMPACT 2010. 5th International, pp.1-4.(IEEE CNF; ISBN: 978-1-4244-9783-
6)(EI).
13. T.-L. Chang, H.-P. Yang, Y.-H. Kuo, J.-C. Wang, C.-P. Wang, 2010, Circular Optical Microstructures Fabricated Using Ultra-Pulsed Laser Ablation and UV Imprint Process, 36th International Micro- and Nano- EngineeringConference(MNE2010), Genoa, Italy P-NANO-68.
14. J.-C. Wang*, T.-L. Chang and Y.-K. Chang, 2010, Window Program of Heat Sink Heat Pipes Thermal Module, 7th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, HEFAT2010, 19-21 July 2010, Antalya, Turkey.
15. J.-C. Wang*, and Y.-P. Tsai, 2010, Investigations on Scuba Diving Regulators, 29th International Conference on Ocean, Offshore and Arctic Engineering: Vol. 2, OMAE2010, June 6-11, 2010, Shanghai, China. Paper no. OMAE2010-21089 pp.767-772.
16. J.-C. Wang* and T.-C. Chen, 2009, Vapor Chamber in High Performance Server, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.364-367.(IEEE CNF; ISBN: 978-1-4244-4341-3)(EI) (NTOU 校長設備費and NSC 97-2218-E-019-003)
17. J.-C. Wang*, 2009, Developing Window Program of Heat Sink with Embedded Heat Pipes, Proceedings of the Fourth International Conference on Thermal Engineering: Theory and Applications, January 12-14, 2009, Abu Dhabi, UAE,P.1-P.7.
18. Y.-P. Tsai and J.-C. Wang, 2008, The Effects of Rotor Incorporated Mold for the Elimination of the Welding Line in Injection Molding, ANTEC. (EI)
19. T.-L. Chang and J.-C. Wang, 2007, Study of Nanopattern Forming with Chemical Coatings for Silicon–Based Stamp in Nanoimprint Process, Processing of IEEE-NANO, pp. 795-798. (IEEE CNF; ISBN: 978-1-4244-0607-4) (EI)
20. T.-L. Chang and J.-C. Wang, 2007, Study of Nanopattern Forming with Chemical Coatings for Silicon–Based Stamp in Nanoimprint Process, Proceedings of the 7th IEEE, International Conference on Nanotechnology, August 2 - 5, 2007, Hong Kong.
21. T.-L. Chang, J.-C. Wang, W.-L. Lai, C.-C. Chen, H.-Y. Lin, F.-H. Ko, F.-Y. Chang, S.-H. Chang, 2007, A Novel Non-Fluorine Mold Release Agent for Ni Stamp in Nanoimprint Process, 33rd International Conference on Micro- and Nano-Engineering, 23-26 September 2007, Copenhagen, Denmark.
22. T.-L. Chang, J.-C. Wang, Y.-J. Tsai, Y.-R. Huang and C.-C. Chen, 2007, Study of Ni Nanopattern Stamps with Non-Fluorine Coating Treatment in Nanoimprint Process, 14th Symposium on Nano Device Technology (SNDT2007), Hsinchu, Taiwan, No.T5-32.
23. H.-S. Huang, J.-C. Wang and S.-L. Chen, 2007, Experimental Investigation on Thermal Performance of Heat Sink with Two Pairs of Embedded Heat Pipes, Proceedings of IPACK2007, ASME InterPACK`07.
24. J.-C. Wang and S.-L. Chen, 2007, Thermal Performance of Two-Phase Closed Thermosyphon Cooling System, Proceedings of the Third International Conference on Thermal Engineering: Theory and Applications May 21-23, Amman, Jordan.