期刊論文 - 國際學術期刊

  1. R.-T. Wang and J.-C. Wang*, 2023, Investigations on Five PMMA Closed Types of Piezo Actuators as a Cooling Fan, Polymers, 14(2), 377(SCI) (IF=4.967).

  2. J.-C. Wang*, 2022, Polymer Materials in Sensors, Actuators and Energy Conversion, Polymers, Book Editor. (SCI) (IF=4.967) .

  3. R.-T. Wang, J.-C. Wang*, and S.-L. Chen, 2022, Investigations on Temperatures of the Flat Insert Mold Cavity using VCRHCS with CFD Simulation, Polymers, 14(15), 3181. (SCI) (IF=4.967).

  4. R.-T. Wang, J.-C. Wang*, and S.-L. Chen, 2022, DESIGN AND TESTING OF A BEARINGLESS PIEZO JET MICRO HEATSINK, Journal of Marine Science and Technology-Taiwan, Vol. 30, Iss. 3, Article 1. (SCI) (IF=0.462).

  5. R.-T. Wang, H. Y. Chang, and J.-C. Wang*, 2021, An Overview on the Novel Core-Shell Electrodes for Solid Oxide Fuel Cell (SOFC) Using Polymeric Methodology, Polymers, 13(16), 2774. (SCI) (IF=4.967).

  6. Y.-T. Chang, R.-T. Wang, and J.-C. Wang*, 2021, PMMA Application in Piezo Actuation Jet for Dissipating Heat of Electronic Devices, Polymers, 13(16), 2596. (SCI) (IF=4.967).

  7. Q. Gang, R.-T. Wang, and J.-C. Wang*, 2021, Estimations on Properties of Redox Reactions to Electrical Energy and Storage Device of Thermoelectric Pipe (TEP) Using Polymeric Nanofluids, Polymers, 13(11), 1812. (SCI) (IF=4.967).

  8. Z.-C. Chen, T.-L. Chang, K.-W. Su, H.-S. Lee, and J.-C. Wang*, 2021, Application of self-heating graphene reinforced polyvinyl alcohol nanowires to high-sensitivity humidity detection, Sensors and Actuators B: Chemical, Vol. 327, January, 128934.(SCI) (IF=9.221)

  9. X. Hou, R.-T. Wang, S. Huang, and J.-C. Wang*, 2021, Thermoelectric Generation and Thermophysical Properties of Metal Oxide Nanofluids, Journal of Marine Science and Technology-Taiwan, Vol. 29, Iss. 1, Article 8. (SCI) (IF=0.462).

  10. P.-H. Yen and J.-C. Wang*, 2019, Power Generation and Electric Charge Density with Temperature Effect of Alumina Nanofluids using Dimensional Analysis, Energy Conversion and Management, Vol.186, April, pp.546-555.(SCI)(IF=11.533).

  11. R.-T. Wang and J.-C. Wang* , 2017, Analysis of Thermal Conductivity in HI-LEDs Lighting Materials, Journal of Mechanical Science and Technology, 31(6), June pp.2911-2921. (SCI) (IF=1.810).

  12. R.-T. Wang and J.-C. Wang* , 2017, Intelligent Dimensional and Thermal Performance Analysis of Al2O3 Nanofluid, Energy Conversion and Management, Vol.138, April, pp.686-697. (SCI) (IF=11.533).

  13. R.-T. Wang and J.-C. Wang* , 2016, Analyzing the Structural Designs and Thermal Performance of Nonmetal LED Lighting Devices of LED bulbs, International Journal of Heat and Mass Transfer, Vol. 99, August, pp.750-761. (SCI) (IF=5.431).

  14. R.-T. Wang and J.-C. Wang* , 2016, Alumina Nanofluids as Electrolytes Comparisons to Various Neutral Aqueous Solutions inside Battery, Journal of Mechanics, Vol. 32, No. 3, June, pp.369-379. (SCI) (IF=1.455).

  15. R.-T. Wang and J.-C. Wang* , 2015, Optimization of Heat Flow Analysis for Exceeding Hundred Watts in HI-LEDs Projectors, International Communications in Heat and Mass Transfer, Vol. 67, October, pp.153-162. (SCI) (IF=6.782).

  16. J.-C. Wang* and W.-J. Chen, 2015, Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection, International Journal of Mechanical Engineering and Automation, Vol. 2, No. 1, January, pp.14-21.

  17. J.-C. Wang* , 2014, L- and U-shaped Heat Pipes Thermal Modules with Twin Fans for Cooling of Electronic System under Variable Heat Source Areas, Heat and Mass Transfer, Vol. 50, issue 11, pp.1487-1498. (SCI) (IF=2.325).

  18. R.-T. Wang, Y.-W. Lee, S.-L. Chen, and J.-C. Wang* , 2014, Performance Effects of Heat Transfer and Geometry on Heat Pipes Thermal Modules under Forced Convection, International Communications in Heat and Mass Transfer, Vol. 57, October, pp.140-149. (SCI) (IF=6.782).

  19. J.-C. Wang* and L.-W. Ye, 2014, Thermoelectric Performances of Seawater and Al2O3 Nanofluids using Battery Facility, Advanced Shipping and Ocean Engineering, September, Vol. 3, Iss. 3, PP. 35-40.

  20. J.-C. Wang* , 2014, U- and L-shaped Heat Pipes Heat Sinks for Cooling Electronic Components Employed a Least Square Smoothing Method, Microelectronics Reliability, Vol. 54, Issues 6/7, June, pp.1344-1354. (SCI) (IF=1.418).

  21. J.-C. Wang* , 2014, Analyzing Thermal Module Developments and Trends in High-Power LED, International Journal of Photoenergy, Vol. 2014, Article ID 120452, May, 11 pages, doi:10.1155/2014/120452. (SCI) (IF=2.535).

  22. J.-C. Wang* , 2014, Thermal Module Design and Analysis of a 230 Watt LED Illumination Lamp under Three Incline Angles, Microelectronics Journal, Vol. 45, Issue 4, April, pp.416-423. (SCI) (IF=1.992).

  23. K.-C. Liu and J.-C. Wang, 2014, Analysis of thermal damage to laser irradiated tissue based on the dual-phase-lag model, International Journal of Heat and Mass Transfer, Vol. 70, March, pp.621-628. (SCI) (IF=5.431).

  24. W.-K. Lin, R.-T. Wang* and J.-C. Wang, 2014, The Performance Measurement of Marine Logistics Information Platform, WIT Transactions on Information and Communication Technologies, 58 Vol. I, pp. 43-49. (EI).

  25. J.-C. Wang* , 2013, Thermoelectric Transformation and Illuminative Performance Analysis of a Novel LED-MGVC Device, International Communications in Heat and Mass Transfer, Vol. 48, November, pp.80-85. (SCI) (IF=6.782).

  26. J.-C. Wang* and W.-C. Chiang, 2013, Researches on Thermo-Electric Properties of Seawater and Al2O3 Nanofluids, Applied Mechanics and Materials, Vol. 394, pp. 14-19. (EI).

  27. J.-C. Wang, C.-Y. Lin, T.-C. Chen 2013, Thermal performance of a vapor chamberbased plate of high-power LEDs filled with Al2O3 nanofluid, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, Vol. 13, No. 4, April, pp.2871-2878. (NSC 100-2221-E-019-064) (SCI) (IF=1.134).

  28. R.-T. Wang* , J.-C. Wang, and L.-M. Chen, 2013, Economic challenges for taiwan private senior high schools: Performance evaluation based on a revised indicators framework, Proceedings of 2012 3rd International Asia Conference on Industrial Engineering and Management Innovation, IEMI 2012, pp. 895-906. (EI).

  29. J.-C. Wang* , 2012, 3-D Numerical and Experimental Models for Flat and Embedded Heat Pipes Applied in High-end VGA Card Cooling System, International Communications in Heat and Mass Transfer, Vol. 39, Issue 9, November, pp.1360-1366. (SCI) (IF=6.782).

  30. J.-C. Wang* , 2012, Novel green illumination energy for LED with ocean battery materials, INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, Vol. 44, Nos. 3/4, pp.187-200. (SCI) (IF=0.743).

  31. R.-T. Wang and J.-C. Wang* , 2012, Analyzing the Pressure-Difference Phenomenon between the Condensing and Boiling Sections in a Heat Pipe Cooling System, International Communications in Heat and Mass Transfer, Vol. 39, Issue 3, March, pp.390-398. (SCI) (IF=6.782).

  32. J.-C. Wang* , 2012, LED with Ocean Battery, Advanced Materials Research, Vols. 378-379, pp. 646-649. (EI).

  33. J.-C. Wang* , 2011, Thermal Investigations on LEDs Vapor Chamber-Based Plates, International Communications in Heat and Mass Transfer, Vol.38, Issue 9, November, pp. 1206-1212. (SCI) (IF=6.782).

  34. C.-Y. Lin, J.-C. Wang and T.-C. Chen, 2011, Analysis of suspension and heat transfer characteristics of Al2O3 nanofluids prepared through ultrasonic vibration, Applied Energy, Vol. 88, Issue 12, pp. 4527-4533. (NSC 98-2221-E019-039) (SCI) (IF=11.446).

  35. J.-C. Wang* , and R.-T. Wang, 2011, A Novel Formula for Effective Thermal Conductivity of Vapor Chamber, EXPERIMENTAL TECHNIQUES, Vol. 35, Issue 5, September/October, pp.35-40. (SCI) (IF=1.700) (Web of Science ranked the paper in the category Engineering, Mechanical. And 69 from the top 500 cited articles from 2010 to 2014).

  36. R.-T. Wang, J.-C. Wang* , and T.-L. Chang, 2011, Experimental Analysis for Thermal Performance of a Vapor Chamber Applied to High-Performance Servers, Journal of Marine Science and Technology-Taiwan, Vol. 19, No. 4, July/August, pp.353-360. (SCI) (IF=0.462). (NTOU 校長設備費 and NSC 97-2218-E-019-003).

  37. J.-C. Wang* , 2011, Applied Vapor Chambers on Non-uniform Thermo Physical Conditions, Applied Physics, Vol. 1, pp.20-26.

  38. J.-C. Wang* , 2011, Investigations on Non-Condensation Gas of a Heat Pipe, Engineering, Vol. 3, pp.376-383.

  39. J.-C. Wang* , A.-T. Li, Y.-P. Tsai, and R.-Q. Hsu, 2011, Analysis for Diving Regulator Applying Local Heating Mechanism of Vapor Chamber in Insert Molding Process, International Communications in Heat and Mass Transfer, Vol. 38, Issue 2, February, pp.179-183. (SCI) (IF=6.782).(Invited Speaker for 2011 Turkey International Modern Medical Forum (2011 TIMF).

  40. J.-C. Wang* and Y.-P. Tsai, 2011, Analysis for Diving Regulator of Manufacturing Process, Advanced Materials Research, Vol. 213, pp. 68-72. (EI).

  41. Y.-P. Tsai, J.-C. Wang* , R.-Q. Hsu, 2011, The Effect of Vapor Chamber in an Injection Molding Process on Part Tensile Strength, EXPERIMENTAL TECHNIQUES, Vol. 35, Issue 1, January/February, pp.60-64. (SCI) (IF=1.700).

  42. J.-C. Wang* , 2011, L-type Heat Pipes Application in Electronic Cooling System, International Journal of Thermal Sciences, Vol.50 , Issue 1, January, pp.97-105. (NSC 98-2221-E019-039) (SCI) (IF=4.779).

  43. J.-C. Wang* , R.-T. Wang, T.-L. Chang, D.-S. Hwang, 2010, Development of 30 Watt High-Power LEDs Vapor Chamber-Based Plate, International Journal of Heat and Mass Transfer, Vol. 53 , Issue 19/20 , September, pp.3900-4001. (SCI) (IF=5.431) (NTOU 校長設備費 and NSC 97-2218-E-019-003).

  44. C.-C. Chang, Y.-F. Kuo, J.-C. Wang, and S.-L. Chen, 2010, Air Cooling for a Large Scale Motor, Applied Thermal Engineering, Vol.30, Issue 11-12, August, pp.1360-1368.(SCI) (IF=6.465).

  45. J.-C. Wang* , 2010, Development of Vapour Chamber-based VGA Thermal Module, International Journal of Numerical Methods for Heat & Fluid Flow, Vol.20, Issue 4, May, pp.416-428. (SCI) (IF=5.181).

  46. J.-C. Wang* , R.-T. Wang, C.-C. Chang and C.-L. Huang, 2010, Program for Rapid Computation of the Thermal Performance of a Heat Sink with Embedded Heat Pipes, Journal of the Chinese Society of Mechanical Engineers, Vol. 31, Issue 1, February, pp.21-28. (NSC 98-2221-E019-039) (SCI) (IF=0.228).

  47. J.-C. Wang* , 2009, Superposition Method to Investigate the Thermal Performance of Heat Sink with Embedded Heat Pipes, International Communications in Heat and Mass Transfer, Vol.36, Issue 7, August, pp. 686-692. (SCI) (IF=6.782).

  48. Y.-P. Tsai, J.-C. Wang* , 2009, Vapor Chamber in Injection Molding Process, International Review of Chemical Engineering (Rapid Communications), Vol.1, N.2, P.179-P.182.

  49. J.-C. Wang* , 2008, Novel Thermal Resistance Network Analysis of Heat Sink with Embedded Heat Pipes, Jordan Journal of Mechanical and Industrial Engineering, Vol. 2, No. 1, Mar., pp. 23-30.

  50. T.-L. Chang, J.-C. Wang, C.-C. Chen, Y.-W. Lee and T.-H. Chou, 2008, A NonFluorine Mold Release Agent for Ni Stamp in Nanoimprint Process, Microelectronic Engineering, Vol.85, Issue 7, July, pp. 1608-1612. (SCI) (IF=2.662).

  51. Y.-W. Chang, C.-H. Cheng, J.-C. Wang and S.-L. Chen, 2008, Heat Pipe for Cooling of Electronic Equipment, Energy Conversion and Management, Vol.49, Nov., pp.3398-3404. (SCI) (IF=11.533).

  52. J.-C. Wang, H.-S. Huang and S.-L. Chen, 2007, Experimental Investigations of Thermal Resistance of a Heat Sink with Horizontal Embedded Heat Pipes, International Communications in Heat and Mass Transfer, Vol.34, Issue 8, October, pp. 958-970. (SCI) (IF= 6.782).

  53. J.-C. Wang, S.-J. Lin, S.-L. Chen and W.-S. Lee, 2005, Charge and Discharge Characteristics of a Thermal Energy Storage Device, Experimental Heat Transfer, Vol. 18, No. 1, Jan.-Mar., pp. 45-60. (SCI) (IF = 3.272).